HYG511R04014A

Product Image

Product Details

Special Request:
Application: Medical
Laser Blind Vias: L1-L2/L3-L4, Vias Plugged with Resin+Filling.

Layer: 4L
Base Material: FR4 TG170
Board Thickness: 0.4±0.1mm
Outer Layer Final Copper Thickness: ≥34.3UM
Inner Layer Final Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 20.08*23.91
Min. W/S(mil): 5.91/5.91
Min. Hole Size: 0.1mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have a price list?
PCB is customized product; all prices will depend on customer actual gerber data and qty request, it will be difficult to provide it.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com