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HYG513F02001A

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HYG513F02001A

Product Details

Special Request: Gold Finger
Layer: 2L
Base Material: FPC
Board Thickness: 0.30+/-0.05mm, connect finger pad area
Final Copper Thickness: 35UM
Surface Finished: ENIG
Unit Size(mm): 69.00*98.00
Min. W/S(mil): 27.56/9.5
Min. Hole Size: 0.35mm
Solder Mask: Yellow coverlay

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ISO Certification

UL Certification

Application areas

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FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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