HYG528R08381A

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Product Details

Special Request:
1. Outer Final Copper Thickness: Min. 33.4um
2. BGA

Layer: 8L
Base Material: FR4 CTI≥175V
Board Thickness: 1.6mm
Surface Finished: ENIG+Impedance Control
Unit Size(mm): 70.00*158.00
Min. W/S(mil): 3.9/3.9
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com