HYG603R04005A

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Product Details

Gold Finger PCB
Special Request:
1. Gold Finger Plating Hard Gold+Beveling (Gold Thickness: 30u"(Min.);
2. Gold fingers without residual gold plating lead wire;
3. Impedance Control

Layer: 4L
Base Material: FR4 TG≥150℃, compliant with IPC4101 99/128 Class C
Board Thickness: 0.8mm
Inner Layer Final Copper Thickness: 35um
Outer Layer Final Copper Thickness: 15um
Surface Finished: ENIG
Unit Size(mm): 28.00*61.80
Min. W/S(mil): 5.98/4.99
Min. Hole Size: 0.25mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have a price list?
PCB is customized product; all prices will depend on customer actual gerber data and qty request, it will be difficult to provide it.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com