HYG630R04003A

Product Image

Product Details

Layer: 4L
Base Material: FR4 TG≥150℃, CTI:175-200
Board Thickness: 1.6mm
Outer Layer Final Copper Thickness: 54um
Inner Layer Final Copper Thickness: 30um
Base Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 76.00*128.80
Min. W/S(mil): 7.87/11.81
Min. Hole Size: 0.25mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

If your lead time for small volume can be 3-5wds?
YES. HoYoGo can offer quick-turn service, we can produce single-sided and double sided within 3~5wds.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com