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HYG630R06017A

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HYG630R06017A

Product Details

Special Request:
1. Provide Ionic Contamination Reports;
2. Solder Mask Model: (Meikaimei) LE-600XZ.

Layer: 6L
Base Material: FR4
Board Thickness: 1.50mm
Outer Layer Final Copper Thickness: 78.7UM
Inner Layer Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 280.00*12.00
Min. Hole Size: 0.3mm
Solder Mask: White

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Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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