HYG663R02005A

Product Image

Product Details

Layer: 2L
Base Material: FR4 (KB6165F)
Board Thickness: 0.5mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 45.60*45.60
Min. Hole Size: 0.3mm
Solder Mask: Black

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com