HYG709R02106A

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Product Details

Special Request: Final Copper Thickness: min.83.7um
Layer: 2L
Base Material: FR4 TG≥135,CTI>175
Board Thickness: 1.0mm±10%
Outer Layer Final Copper Thickness: 3OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 288.00*14.08
Min W/S(mil): 10/8.7
Solder Mask: White

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com