HYG709R04121A

Product Image

Product Details

Special Request:
1. Solder Mask Ink Model: PM-500 WD-85SF;
2. Board Bending: ≤ 0.75%;
3. Impedance Control.

Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 19.00*200.00
Min W/S(mil): 5.9/5.9
Min Hole Size: 0.15mm
Solder Mask: White

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com