HYG709R04122A

Product Image

Product Details

Special Request:
1. Solder Mask Ink Model: PM-500 WD-85SF;
2. Board Bending: ≤ 0.75%;
3. Impedance Control.

Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 19.00*150.00
Min W/S(mil): 5.9/5.9
Min Hole Size: 0.15mm
Solder Mask: White

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your quality standard? What’s certificates do you have?
Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001, ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com