HYG709R04136A

Product Image

Product Details

Layer: 4L
Base Material: FR4
Board Thickness: 1.6mm
Outer Layer Final Copper Thickness: 38.4UM
Inner Layer Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 24.00*121.00
Min. W/S(mil): 5.9/5.9
Min. Hole Size: 0.2mm
Solder Mask: Blue

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com