HYG730R02003A

Product Image

Product Details

Special Request:
1. IPC-600G Class 3;
2. Solder Mask Thickness: Min. 8um, Max. 30um.

Layer: 2L
Base Material: FR4 TG150 KB6165F
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: Immersion Tin
Unit Size(mm): 280.00*210.00
Min. W/S(mil): 11.8/7.9
Min. Hole Size: 0.3mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com