HYG7777R06002A

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Product Details

Blind&buried Via Board
Layer: 6L
Base Material: FR4 TG170(S1000-2m)
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 90.00*50.00
Min W/S(mil): 3.4/5.37
Min Hole Size: 0.15mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com