HYG796F02006A
Product Image
Product Details
Special Request: PI Stiffener
Layer: 2L
Base Material: PI
Board Thickness: 0.33mm
Final Copper Thickness: min.40um
Surface Finished: ENIG
Unit Size(mm): 64.50*9.00
Min W/S(mil): 5.9/7.9
Min Hole Size: 0.3mm
Solder Mask: Yellow coverlay
ISO Certification
UL Certification
Application areas
Who will be our parters
FAQ
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Is there UL certificate for your flexible board?
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YES. We can offer UL certificate of FPC.
Contact us
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.