HYG803R02048A

Product Image

Product Details

Special Request:
Solder Mask Thickness:
Solder Mask Thickness on Copper Edge: Min. 10um,
Solder Mask Thickness on Copper Surface: 10-30um,
Base material position cannot exceed 40um.

Layer: 2L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 55.10*85.95
Min W/S(mil): 9.8/9.8
Min Hole Size: 0.3mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com