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HYG803R04061A

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HYG803R04061A

Product Details

Special Request:
Solder Mask Thickness on Copper Edge: Min. 10um,
Solder Mask Thickness on Copper Surface: 10-30um,
The base material position is not allowed to exceed 40um.

Layer: 4L
Base Material: FR4
Board Thickness: 1.60mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 136.00*57.11
Min. W/S(mil): 7.09/6.29

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Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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