HYG804R04004A

Product Image

Product Details

Special Request: BGA
Layer: 4L
Base Material: FR4 TG 170(S1000-2)
Board Thickness: 1.57mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 86.65*18.96
Min. W/S(mil): 6/5
Min. Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Do you have quick-turn service for prototype?
Yes. HoYoGo offers quick-turn service for prototype. Delivery time: 3~7wds according to PCB layer count and layout.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com