HYG808R02041A

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Product Details

Special Request:
1. PPAP Level 3 supplied
2. V-CUT Remaining Thickness: 0.3+0.2/-0mm, Angle: 30±5°
3. Sn Thickness: 0.76-38μm
4. Board Bending: MAX 1%
5. Plated Through Hole Copper Wall Thickness: Min. 25um
6. IPC-6012 Class3

Layer: 2L
Base Material: FR4
Board Thickness: 1.2mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 5.50*50.00
Min W/S(mil): 19.7/26.3

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your most advantage of your supply?
@Standard mass production (>50sqm) from 1~8layer can be with very good price.
@ Mass production (>50sqm) of CEM-1, Alu material can be with very good price.
@ Special: we can produce long board up to 550x1500mm, thin board of min 0.15mm.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com