HYG808R04039A

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Product Details

Special Request: Press fit technology;
Plated Through Hole Copper Wall Thickness: Min. 25um
Layer: 4L
Base Material: FR4 TG≧135
Board Thickness: 1.5mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 98.00*53.90
Min Hole Size: 0.3mm
Solder Mask: Matte Black

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com