HYG808R04050A

Product Image

Product Details

Special Request: PPAP Level 3 supplied
Layer: 4L
Base Material: FR4 TG135
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 140.00*31.00
Min W/S(mil): 10/5.96
Min Hole Size: 0.3mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you update a WIP to us every day?
Yes, no problem. We can update it to you every day or every couple of days depends on customer request.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com