HYG808R04056A

Product Image

Product Details

Special Request: PPAP Level 3 supplied
Layer: 4L
Base Material: FR4 TG≥135
Board Thickness: 1.55mm
Final Copper Thickness: 0.5/1OZ(inner/outer)
Surface Finished: ENIG
Unit Size(mm): 159.50*36.50
Min W/S(mil): 7.87/7.87
Min Hole Size: 0.3mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

If your lead time for small volume can be 3-5wds?
YES. HoYoGo can offer quick-turn service, we can produce single-sided and double sided within 3~5wds.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com