HYG808R06035A

Product Image

Product Details

Layer: 6L
Base Material: FR4 TG135
Board Thickness: 1.55mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Gold Finger
Unit Size(mm): 45.0*60.0
Panel Size(mm): 280.0*210.0
Min W/S(mil): 8/6

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer the third-party service, to make shipment direct to end customer but without documents (invoice)?
Yes, from our carrier partners, DHL, UPS, FEDEX, we have signed this service. And our forwarder by air or sea shipment can support this too.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com