HYG885F02025A

Product Image

Product Details

Layer: 2L
Base Material: PI(CND2200MXI: 18Cu/20AD/50PI/20AD/18Cu)
Board Thickness: 0.25mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 233.51*147.28
Min W/S(mil): 11.8/5.9
Min Hole Size: 0.3mm
Solder Mask: Black Coverlay

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Is there UL certificate for your flexible board?
YES. We can offer UL certificate of FPC.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com