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Products

HYG885R08036A

Product Image
HYG885R08036A
Product Details
Special Request: 
1. Solder Mask: Green Matt(SR-500 GM13)
2. Solder Mask Thickness on Copper Surface: Max 50.8um
3. Plated Through Hole Copper Wall Thickness: Min 38.1um
4. Outer Layer Final Copper Thickness: Min 52.9um
5. Inner Layer Final Copper Thickness: Min 195um

Layer: 8L
Base Material: FR4 TG≥135
Board Thickness: 3.54mm
Surface Finished: ENIG
Unit Size(mm): 454.00*257.00
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • What’s your quality standard? What’s certificates do you have?
  • Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001,ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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