HYG896F01025B

Product Image

Product Details

Layer: 1L
Base Material: PI
FPC Thickness: 0.17mm
PI+ Stiffener Thickness: 0.3mm
Gold Thickness: 0.05-0.1UM
Finger height: 3.3±0.3MM
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 77.3*280.0

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer me better payment term (OA 30/45/60 DAYS)?
It depends on customer credit and their company finance. In general, we suggest start with prepayment for some testing order to get credit record. OA term can be released step by step according to cooperation situation.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com