HYG898R08005A

Product Image

Product Details

Layer: 8L
Base Material: FR4
Board Thickness: 1.65mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 66.5*63.0
Panel Size(mm): 133.0*146.0
Solder Mask: Green Matt
Min W/S(mil): 7/7
Min Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer me better payment term (OA 30/45/60 DAYS)?
It depends on customer credit and their company finance. In general, we suggest start with prepayment for some testing order to get credit record. OA term can be released step by step according to cooperation situation.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com