HYG898R10250A

Product Image

Product Details

Special Request: BGA
Layer: 10L
Base Material: FR4 TG170
Board Thickness: 1.4mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 154.5*108.0
Min W/S(mil): 4.3/4
Min Hole Size: 0.2mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Can you offer DAP … term?
DAP is the old DDU from intercoms 2000. So we will follow this as Delivery Duty Unpaid.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com