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HYG902R01020A

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HYG902R01020A

Product Details

Special Request:
1. Printed solder mask on both sides of the board;
2. Gold Finger Hard Gold Thickness: Min. 30u".

Layer: 1L
Base Material: FR4
Board Thickness: 1.57mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead
Unit Size(mm): 174.00*187.34
Min W/S(mil): 31.5/30

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ISO Certification

UL Certification

Application areas

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FAQ

Can you produce board of gold finger?
Yes. HoYoGo can offer you gold finger, Au thickness can be suggested standard 30u” or per customer request.

Contact us

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

(+86)-755-2300-1582

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