HYG905R12008A

Product Image

Product Details

Layer: 12L
Base Material: FR4 TG170
Board Thickness: 1.85mm
Final Copper Thickness: 1/H/H/H/H/1/1/H/H/H/H/1 OZ
Surface Finished: ENIG+Impedance
Unit Size(mm): 251.46*226.82
Panel Size(mm): 251.46*245.87
Min W/S(mil): 4/4
Min Hole Size: 0.18mm
Special Request: Vias Plugged with Resin

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com