High Density Interconnector PCB

Product Image

Product Details

High density PCB
Special Request: Blind buried via
Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4*5.37
Min Hole Size: 0.15mm
Special Request: Impedance Control

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s kind of PCB can you produce?
Our production is producing rigid PCB from 2~56layer with small- medium- mass volume. In the meantime, we can offer you FPC, Rigid-flex, HDI, all other special PCBs from our partner production.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com