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Products

Immersion Tin PCB

Product Image
Immersion Tin PCB
Product Details
Layer: 6L
Base Material: FR4 TG150
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Immersion Tin
Unit Size(mm): 30.0*50.95
Panel Size(mm): 231.5*182.5
Min W/S(mil): 5.9/5.9
Min Hole Size: 0.2mm
Solder Mask: Green Matt
Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ
  • Can we pay by paypal?
  • YES. you can pay to below account:paypal.me/hoyogo?Account: anandal@hygpcb.com

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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