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Products

HYG898A01139A

Product Image
HYG898A01139A
HYG898A01139A
Production process

Specification
Code HYG898A01139A Customer PN


Layer 1 Blind/Buried Via NO

Base Material ALU
Unit Size(mm) 30.0000
X 22.50000
Board thickness 2mm Panle Size(mm) 225.0000
X 150.0000
Min hole 2.0mm Pcs/Panle 5 X 10
Total Holes 100 Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 9.84 Min Hole Copper Thickness /

Outline Finish CNC+V-CUT
Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing
ENIG Thickness


X-out / Solder Mask Green matt

Special request /
Silkscreen White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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