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Products

HYG088R00005C

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HYG088R00005C
HYG088R00005C
Production process

Specification
Code HYG088R00005C Customer PN


Layer 1 Blind/Buried Via NO

Base Material FR4 Unit Size(mm) 77.0500 X 177.0200
Board thickness 1.0mm Panle Size(mm) 77.0500 X 177.0200
Min hole / Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) / Min Hole Copper Thickness 20um

Outline Finish CNC Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing



X-out / Solder Mask White

Special request / Silkscreen Black

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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