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1L-FR4 PI-High density pcb

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1L-FR4 PI-High density pcb
Production process

Specification
Code HYG18072501 Customer PN


Layer 1L Blind/Buried Via NO

Base Material FR4-PI Unit Size(mm) 27.3000 X 21.3000
Board thickness / Panle Size(mm) 85.7000
 X 114.8000
Min hole 0.6mm Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 6/4mil Min Hole Copper Thickness N/A

Outline Finish CNC+V-CUT Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing
 7oz gold finger

X-out / Solder Mask Green

Special request
Silkscreen /

ISO Certification

UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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