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HYG306RF02002A

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HYG306RF02002A
Production process

Specification
Code HYG306RF02002A Customer PN


Layer 2 Blind/Buried Via NO

Base Material Flex&Rigid PCB Unit Size(mm) 164.1300
 X 72.6600
Board thickness 0.7/0.25 Panle Size(mm) /
 X /
Min hole / Pcs/Panle 1 X 1
Total Holes /
 Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 19.69/19.61 Min Hole Copper Thickness 20um

Outline Finish CNC
 Finish thickness tolerance +/-0.1mm

Contour tolerance +/-0.15mm Surface Finishing
 ENIG Thickness

X-out / Solder Mask /

Special request / Silkscreen /
Customer Evaluation
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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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