Code | HYG1281F02002A | Customer PN |
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Layer | 2 | Blind/Buried Via | NO |
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Base Material | PI,ITEQ | Unit Size(mm) |
5.7200 |
X | 36.0400 |
Board thickness | 0.23mm | Panle Size(mm) |
/ |
X | / |
Min hole |
0.3mm |
Pcs/Panle | / | X | / |
Total Holes | 26/PCS | Copper OZ(finish) | 1OZ | Base Cu | / |
W/S(mil) | 6.3/42.7 | Min Hole Copper Thickness | 20um |
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Outline Finish |
Lasering |
Finish thickness tolerance | +/-0.05mm |
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Contour tolerance | +/-0.15mm |
Surface Finishing |
ENIG Thickness |
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X-out | / | Solder Mask | Yellow |
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Special request | / | Silkscreen | White |
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Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.