Code | HYG802F02013A | Customer PN |
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Layer | 2 | Blind/Buried Via | NO |
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Base Material | PI | Unit Size(mm) |
59.9300 |
X | 35.0700 |
Board thickness | 0.26mm | Panle Size(mm) | 180.0000 | X | 118.0000 |
Min hole |
0.7mm |
Pcs/Panle | 2 | X | 4 |
Total Holes | 24 | Copper OZ(finish) | 1OZ | Base Cu | / |
W/S(mil) | 9.8/8 | Min Hole Copper Thickness | / |
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Outline Finish | CNC | Finish thickness tolerance | +/-0.05mm |
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Contour tolerance | +/-0.13mm |
Surface Finishing |
ENIG Thickness |
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X-out | / | Solder Mask | / |
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Special request | Flex,Yellow cover | Silkscreen | / |
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Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.