4 L FR4 TG>=150 TD>=320 1.6mm

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Product Details

[Product details]

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Layer: 4	Base Material: FR4 TG>=150 TD>=320
Board thickness: 1.6mm	Unit Size(mm): 119 x 247
Min hole size: 0.6mm	Panel Size(mm): 257 x 240
Total hole: 1017/SET	W/S(mil): 15/9.7
Copper OZ: 3OZ	Surface finishing: ENIG Thickness& Peelable mask
Solder Mask: Green	Silkscreen：White

[Quotation]

Cu P/N	PCB 45825
Nuber of Layer	Unless otherwise noted on the fabrication drawing, the minimum dielectric separation between any adjacent conductive layers shall be 300um, minimum and there shall be no less than two sheets of dielectric material used between each pair of adjacent conductive layers.
Thickness PCB	1.6mm + -10%
Thickness Cu Finish	OUTER min. 3OZ (105 micron)	Inner 2OZ (70 micron)
Material	FR4 DT>=320C (Decomposition temperature) TG150
Size/Panel	257 X 240 mm
Format File	Ucam DPF
Finish	ENIG(Au>=0.05um-Ni>=3um)-Solder Mask(Color Green)-Silkscreen White Top- V-CUT- Routing-100% E-TEST-PEELABLE BOTTOM
Q.TY	See the order

	Attention: - You don't insert you r firm Logo and your UL logo - Drill tolerance(unless specified) PTH+0.10/-0.05mm, NPTH+ -0.05mm, Press-FIT+ -0.05mm - General machanical tolerance (Unless specified) + -0.10mm by Routing process - V-cut core 0.40mm +/-0.1 - General requirements compliant to IPC A600 class 2/IPC 6012 class2(latest revisions) - You have to compile the datecode (week-year of production) on solder mask bottom

[Featurer]

Degreasing

ü Degreasing: Removal of grease and oxides on copper surfaces

ü Parameter control

Main components	Process range
ACL-702	80-120ml/l
Time	4’35“-5’
Temperature	30-50℃

Micro-etching

ü Silicon micro-etching: increase the roughness of the copper surface

ü Parameter control

Main project	Process range
NaPS	50-90ml/l
H2SO4	10-30ml/l
Cu2+	2-20g/l
Time	1’30“
Temperature	25-30℃

Pickling

Pickling: Removes residual SPS from copper surfaces

Parameter control

Main components	Process range
H2SO4	40-60ml/l
Time	50“~1’10”
Temperature	Normal temperature

Pre-preg

Main project	Process range
H2SO4	10-30ml/l
Time	30“

[Technical Advantages]

1. Due to the different crystal structure formed by Immersion Gold and Gold Plating, Immersion Gold will be yellower than Gold Plating and customers will be more satisfied.

2. Because the crystal structure formed by Immersion Gold and Gold Plating is not the same, Immersion Gold is easier to weld than Gold Plating, which will not cause bad welding and cause customer complaints.

3. Since there are only nickel gold on the pads of the gold sink, the signal transmission in the skin effect will not affect the signal in the copper layer.

4, due to the gold than the gold plating crystal structure is more dense and difficult to produce oxidation.

5, due to the gold plate only nickel gold on the pad, it will not produce gold wire caused by the micro-short.

6, due to the gold plate only the nickel pad on the pad, so the line of solder and the copper layer more firmly.

7. The project will not affect the spacing when making compensation.

8, due to the formation of gold and gold plated crystal structure is not the same, the stress of the gold plate is more easily controlled, for a bonded product, it is more conducive to the bonding process. At the same time, because the gold is more gold-plated than the gold-plated one, the gold-fingered gold finger does not wear.

9. The flatness and service life of the gold plate are as good as the gold plate.