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Products

HYG026R06034A

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HYG026R06034A
Product Details

High Temperature Adhesive

Layer : 6L

Base Material : FR4 TG150

Board Thickness : 1.55mm

Surface Finished : ENIG

Unit Size(mm) : 190.0*110.0

Panel Size(mm) : 190.0*134.0

Min W/S(mil) : 7.9/7.9

Min Hole Size : 0.3mm

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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