High Temperature Adhesive
Layer : 6L
Base Material : FR4 TG150
Board Thickness : 1.55mm
Surface Finished : ENIG
Unit Size(mm) : 190.0*110.0
Panel Size(mm) : 190.0*134.0
Min W/S(mil) : 7.9/7.9
Min Hole Size : 0.3mm
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.