Rigid-Flex PCB
Layer: 4L
Base Material: FR4 TG150+PI
Rigid Board Thickness: 0.7mm
Flex Board Thickness : 0.15mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 19.0*154.3
Panel Size(mm): 114.0*196.0
Min W/S(mil): 5.9/5.9
Min Hole Size: 0.15mm
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HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.