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HYG1105A02001

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HYG1105A02001
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Specification
Code HYG1105A02001A Customer PN


Layer 2 Blind/Buried Via NO

Base Material Alu 1.5W
 Unit Size(mm) 457.0000
 X 19.8000
Board thickness 1.2mm Panle Size(mm) 457.0000
 X 91.2000
Min hole 0.6mm Pcs/Panle 1 X 4
Total Holes 120 Copper OZ(finish) 1OZ Base Cu /
W/S(mil) 19.7/19.7 Min Hole Copper Thickness 20um

Outline Finish CNC+V-CUT
 Finish thickness tolerance +/-10%

Contour tolerance +/-0.13mm Surface Finishing
 HASL Lead Free

X-out / Solder Mask White

Special request
/ 		Silkscreen Black

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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