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HYG709A01019A

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HYG709A01019A
Product Details

Layer : 1L

Base Material : ALU 2W/MK

Board Thickness : 1mm

Final Copper Thickness : 2OZ

Surface Finished : HASL Lead Free

Unit Size(mm) : 76.0*76.0

Panel Size(mm) : 170.0*248.0

Min W/S(mil) : 19.7

Solder Mask : White

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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