Layer: 2L
Base Material: FR4 TG130
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: HASL Lead Free
Unit Size(mm): 165.1*99.9
Panel Size(mm): 185.1*199.9
Min W/S(mil): 7.9/8.5
Min Hole Size: 0.2mm
Solder Mask: Green Matt
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.