Code | HYG896F01025A | Customer PN |
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|
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Layer | 1 | Blind/Buried Via | NO |
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Base Material | PI | Unit Size(mm) |
120.3250 |
X |
214.9400 |
Board thickness | 0.3mm | Panle Size(mm) |
/ |
X | / |
Min hole | / | Pcs/Panle | 1 | X | 1 |
Total Holes | / | Copper OZ(finish) | 1OZ | Base Cu | / |
W/S(mil) | 10/9.6 | Min Hole Copper Thickness | / |
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|
Outline Finish |
CNC |
Finish thickness tolerance | +/-10% |
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Contour tolerance | +/-0.1mm |
Surface Finishing |
ENIG Thickness |
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|
X-out |
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Solder Mask | Yellow |
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Special request |
FPC thickness:0.17mm,The thickness of the gold:0.2um,Finger height:3.3+/-0.3mm |
Silkscreen |
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.