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Products

HYG896F02001A

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HYG896F02001A
HYG896F02001A
Production process

Specification
Code HYG896F02001A Customer PN


Layer 2 Blind/Buried Via NO

Base Material PI Unit Size(mm) 342.5000 X 163.0000
Board thickness 0.3mm Panle Size(mm) /
X /
Min hole / Pcs/Panle 1 X 1
Total Holes / Copper OZ(finish) 1OZ Base Cu /
W/S(mil) /
Min Hole Copper Thickness 35um

Outline Finish CNC
Finish thickness tolerance +/-8%

Contour tolerance +/-0.15mm Surface Finishing
ENIG Thickness


X-out
Solder Mask Yellow

Special request


Silkscreen
Customer Evaluation
20170809113338_62641_副本_副本.jpg 20170809115057_80100_副本.jpg one.jpg 20170809115226_98108_副本.jpg

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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