Layer : 4L
Base Material : FR4 TG150+PI
Board Thickness : 0.7mm
Final Copper Thickness : 1OZ
Surface Finished: ENIG
Unit Size(mm) : 19.0*154.28
Panel Size(mm) : 114.0*196.0
Min hole size : 0.2mm
Min Hole Copper Thickness : 20um
Min W/S(mil) : 10/7
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.