Semiflex PCB | HYG1005R04005A

Product Image

Product Details

Special Request:
1. Semiflex Area Thickness: 260±40um(Min. PP Thickness 150um included);
2. Semiflex Area /2,5D PCB (1Ri-3Ri)Required bending radius R5 over 180°;
3. Depth Milling.

Layer: 4L
Base Material: FR4
Board Thickness: 1.0mm
Outer Layer Final Copper Thickness: 38UM
Inner Layer Final Copper Thickness: 1OZ
Base Copper Thickness: 0.5OZ
Surface Finished: ENIG
Unit Size(mm): 59.50*118.00
Min. W/S(mil): 9.84/5.9
Min. Hole Size: 0.25mm

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

Are you a manufacturer (Factory) or trading company?
HoYoGo is a manufacturer with a mass production of 500000 sqm factory and a medium-size production for small-medium volume. Our UL No. is E493066.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com