blind and buried vias PCB

Product Image

Product Details

Layer: 6L
Base Material: FR4 TG171
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Impedance Control
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4/5.37
Min Hole Size: 0.15mm
L1-L3, L3-L4, L4-L6 have blind and buried vias

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What’s your quality standard? What’s certificates do you have?
Our production is strictly following high quality system of automotive products, we certified with ISO9001, ISO14001,ISO13485 and TS16949 and C-UL-S. All products strictly follow acceptance standard IPC-A-600-H and IPC-6012.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com