How to Correctly Handle Moisture Sensitive Components in PCBA Factory

PCBA factory will encounter some special components during processing, such as moisture sensitive components. The impact of such components on processing is no less than ESD, so it is necessary to strengthen the storage and use management of moisture sensitive components. So how should PCBA factories correctly handle moisture sensitive components?

PCBA factories can store moisture sensitive components reasonably to avoid damage to components due to moisture absorption of moisture sensitive components. Therefore, the defect rate of the product can be reduced, and the reliability of the product can be improved.

In actual processing, for moisture sensitive components that are affected by moisture are generally baked according to the baking conditions in the warning label on the original packaging bag of the manufacturer. For component manufacturers who do not have corresponding requirements, it is recommended to use high-temperature baking. For component manufacturers who do not have corresponding requirements, it is recommended to use high-temperature baking. In the replacement process of moisture sensitive components, attention should be paid to prevent ESD damage of the components. Generally, it is not recommended to use low temperature for baking of moisture sensitive components.

Precautions for the use of PCBA processing moisture sensitive components:

1. Oven requirements for baking: Ventilation and the ability to maintain the required temperature under the condition of humidity less than 5%.

2. If there is no special statement from the manufacturer, SMT components transported in a high-temperature carrier can be baked at 125°C.

3. SMT components transported in a low-temperature carrier cannot be baked at a temperature higher than 40°C.

4. The paper or plastic carrier should be removed before baking, and the rubber belt or plastic tray should also be removed when baking at 125°C.

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