PCBA Factory Solder Paste Technological Process

Solder paste technology is an essential part of PCBA processing. Solder paste plays a key role in the soldering process as a medium connecting components and PCB boards. So do you know what is the process of PCBA factory solder paste technology?

1. Preparations before printing

1) Check the printing working voltage and air pressure, and be familiar with the technological requirements of the product.

2) Confirm whether the software program name is the current production model and whether the version is correct.

3) Check the solder paste, for example: manufacturing date, brand model, specification, etc. of the solder paste.

4) Solder paste mixing: Solder paste should be fully stirred evenly with a solder paste mixer or manually before use.

5) Check whether the PCB is correct, whether it is wrong or defective. Read the PCB product certificate, if the PCB manufacturing date is more than 6 months, the PCB should be dried, usually the day before the solder paste.

6) Check whether the stencil is consistent with the current production PCB, whether the window is blocked, and whether the appearance is good.

2. Adjust Printing Technological Parameters

After turning on the power supply and electricity, the printing machine enters the open state(initialization). For the newly production PCB, the relevant parameters of the length, width, thickness and positioning identification mark of the PCB must be input first.

3. Printing Solder Paste

When formally printing solder past, the following items should be paid attention to:

1) The amount of solder paste used for the first time should not be too much, generally estimated according to the size of the PCB.

2) During use, attention should be paid to adding new solder paste to keep the solder paste rolling forward during printing.

3) Pay attention to the environmental quality when printing solder paste - no wind, clean, temperature 23±3°C, relative humidity <70%.

4. Printing Quality Inspection

For the detection of stencil printing quality, the methods currently used mainly include visual inspection and automatic optical inspection. When testing the quality of solder paste printing, different testing tools and methods should be used according to the component type.

5. Finish

When a product is finished or a day's work is over, the stencil and scraper must be cleaned. If the window is blocked, do not stab it with a hard metal needle to avoid damaging the shape of the window. The solder paste needs to be stored in another container, it can be reused according to the situation. After the stencil is cleaned, it should be blown placed with compressed air and properly stored on the tool rack. The scraper should also be placed in the specified place and ensure that the scraper is not damaged.

At the end of the work, the machine should be returned to the shutdown state, and the power and air source should be turned off. At the same time, the work log should be filled out and the machine maintenance should be carried out.

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